WCO classification path
- Chapter84Machinery and mechanical appliances
- Heading8486Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories
- Subheading848610Machines and apparatus for the manufacture of boules or wafers
- National84861010Machines and apparatus, as follows:for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing;sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovens
84861010
"Machines and apparatus, as follows:for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing;sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovens"
HS code 84861010 (Chapter 84 "Machinery and mechanical appliances"; Heading 8486 "Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories"; Subheading 848610 "Machines and apparatus for the manufacture of boules or wafers") under the Australia tariff schedule classifies "Machines and apparatus, as follows:for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing;sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovens". Australia customs apply General rate of Free. Statutory unit of measure: ... 2 free trade agreement preferential rates are available for this code.
Tariff Schedule
| Classification | Rate |
|---|---|
一般税率 General rate | Free |
FTA Preferential Rates
2 agreements available · certificate of origin required
| Agreement | Rate |
|---|---|
| IA-CEPA | Free |
| ChAFTA | Free |
Global Benchmark
HS-6 prefix 8486.10 across other jurisdictions