WCO classification path

  1. Chapter82Tools, cutlery of base metal
  2. Heading8202Hand saws; blades for saws of all kinds (including slitting, slotting or toothless saw blades)
  3. Subheading820239Other, including parts
  4. National8202392010For machines sawing semiconductor wafer or device into each unit

8202392010

"For machines sawing semiconductor wafer or device into each unit"

HS code 8202392010 (Chapter 82 "Tools, cutlery of base metal"; Heading 8202 "Hand saws; blades for saws of all kinds (including slitting, slotting or toothless saw blades)"; Subheading 820239 "Other, including parts") under the Korea tariff schedule classifies "For machines sawing semiconductor wafer or device into each unit". Korea customs apply MFN rate of 8, WTO bound rate 0. Statutory unit of measure: KG. 30 free trade agreement preferential rates are available for this code.

Tariff Schedule

ClassificationRate
MFN 税率
MFN rate
8
WTO 约束税率
WTO bound rate
0

FTA Preferential Rates

30 agreements available · certificate of origin required

AgreementRate
AKFTA (ASEAN-Korea)0%
KAFTA (Korea-Australia)0%
CKFTA (Canada-Korea) / CPTPP0%
Korea-Central America (Costa Rica)0%
Korea-Central America (Honduras)0%
Korea-Central America (Nicaragua)0%
Korea-Central America (Panama)0%
Korea-Central America (El Salvador)0%
Korea-Chile0%
Korea-Colombia0%
Korea-EFTA0%
Korea-EU0%
Korea-UK0%
Korea-Indonesia (CEPA)0%
Korea-Israel0%
Korea-India (CEPA)0%
Korea-Cambodia0%
Korea-New Zealand0%
Korea-Peru0%
Korea-Philippines0%
Korea-Singapore0%
Korea-Turkey0%
KORUS (Korea-US)0%
Korea-Vietnam0%
RCEP0%
Korea-China1.6%
RCEP (ASEAN)7.5%
RCEP (Australia)7.5%
RCEP (China)8%
RCEP (New Zealand)7.5%

HS-6 prefix 8202.39 across other jurisdictions

8202392010 · For machines sawing semiconductor wafer or device into each · Korea · Treayo · 全球关税