Korea · Heading· 5 subheadings· 79 codes

8486Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories

Subheadings (6-digit WCO)

Korea tariff lines (10-digit)

All national sub-divisions in Korea's tariff schedule

HS CodeDescriptionPrimary rate
8486101000Spin dryers by centrifugal process0
8486102000Apparatus for growing or pulling monocrystal boules0
8486103010Machines for sawing monocrystal boules into slices0
8486103020Grinding or polishing machines for processing of wafer, including lapping machines0
8486103090Other0
8486104010Operated by laser or other light or photon beam processes0
8486104020Operated by electro-chemical, electron beam, ionic-beam or plasma arc process0
8486105010Resistance heated furnaces and ovens0
8486105030Other furnaces and ovens0
8486109000Other0
8486201000Spin dryers by centrifugal process0
8486202100Resistance heated furnaces and ovens0
8486202200Furnaces and ovens functioning by induction or dielectric loss0
8486202300Other furnaces and ovens0
8486203000Ion implanters for doping semiconductor materials0
8486204000Machines for depositing membrance or sputtering metal on semiconductor wafers0
8486205000Machine-tools (including presses) for working metal by bending, folding, straightening, flattening0
8486206010Direct write-on-semiconductor wafer apparatus0
8486206020Step and repeat aligners0
8486206091Laser operated apparatus0
8486206099Other0
8486207000Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers0
8486208100Operated by laser or other light or photon beam processes0
8486208410For dry-etching patterns on semiconductor materials0
8486208420Apparatus for stripping or cleaning semiconductor wafers0
8486208490Other0
8486209100Mechanical appliances for projecting, dispersing or spraying liquids or powders0
8486209200Machines of coating and developing or stabilizing photoresist0
8486209310Grinding or polishing machines for processing of semiconductor wafer, including lapping machines0
8486209320Dicing machines for scribing or scoring semiconductor wafers0
8486209390Other0
8486209400Machine for washing wafers, carrier or tube0
8486209500Machine for mounting tape on semiconductor wafers0
8486209600Machine for sawing semiconductor wafer into chips0
8486209900Other0
8486301010Grinding or polishing machines0
8486301020Coating or developing machines0
8486301031Operated by physical method0
8486301032Operated by chemical method0
8486301040Apparatus for the projection or drawing of circuit patterns on sensitised flat panel display substrates0
8486301050Etchers machines0
8486301060Apparatus for stripping or cleaning0
8486301090Other0
8486302010Grinding or polishing machines0
8486302020Coating or developing machines0
8486302031Operated by physical method0
8486302032Operated by chemical method0
8486302040Apparatus for the projection or drawing of circuit patterns on sensitised flat panel display substrates0
8486302050Etchers machines0
8486302060Apparatus for stripping or cleaning0
8486302070Machine and apparatus for liquid crystal progress of work0
8486302090Other0
8486401010Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates0
8486401020Focused ionic-beam milling machines for removing or repairing mask and reticle0
8486401030Machines of coating, developing or stabilizing photoresist0
8486401040Machines and apparatus for etching, cleaning or stripping mask and reticle0
8486401090Other0
8486402010Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors0
8486402020Machines for inserting or removing semiconductor devices0
8486402031Encapsulation equipment for assembly of semiconductors0
8486402039Other0
8486402040Machines to attach solder ball on semiconductor circuit board or ceramic board0
8486402070Moulds for rubber or plastics of injection or compression types0
8486402080Machines for bonding semiconductor die, washing wafers, carrier or tube0
8486402091Machine-tools (including presses) for working metal by bending, folding, straightening, flattening, for semiconductor leads, whether or not numerically controlled0
8486402093Machines for forming connections(bump) on an entire wafer before dicing0
8486402095Resistance heated electric furnaces and ovens0
8486402099Other0
8486403010Automated machines and apparatus for transport, handling and storage of semiconductor wafers, wafer cassettes, boxes and other material for semiconductor devices0
8486403020For lifting, handling, loading or unloading of flat panel display0
8486403090Other0
8486901000Of machines and apparatus for the manufacture of boules or wafers0
8486902030Electrostatic chuck0
8486902040Of machines for coating, developing, deposition or etching0
8486902090Other0
8486903050Of machines and apparatus for the manufacture of OLED displays0
8486903060Of machines and apparatus for the manufacture of liquid crystal displays0
8486903090Other0
8486904000Of machines and apparatus specified in Note 11 (C) to this Chapter0
Korea HS 8486 · Machines and apparatus of a kind used solely or principally · Treayo · 全球关税