HS Code	Description	Primary rate
84864010	Machines and apparatus, as follows:machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads;soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices	Free
84864020	Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00	Free
84864031	Injection or compression moulds for rubber or plastics, other than goods of 8486.40.10	5%DCS:4%DCT:5%From 1 July 2019:Free
84864039	Other	5%DCS:4%DCT:5%From 1 July 2018:2.5%From 1 July 2019:Free
84864040	Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process	Free
84864091	Machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays	From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free
84864099	Other	5%From 1 July 2018:3.75%From 1 July 2019:Free