WCO classification path
- Chapter84Machinery and mechanical appliances
- Heading8486Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories
- Subheading848640Machines and apparatus specified in Note 11(c) to this Chapter
- National84864010Machines and apparatus, as follows:machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads;soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices
84864010
"Machines and apparatus, as follows:machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads;soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices"
HS code 84864010 (Chapter 84 "Machinery and mechanical appliances"; Heading 8486 "Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories"; Subheading 848640 "Machines and apparatus specified in Note 11(c) to this Chapter") under the Australia tariff schedule classifies "Machines and apparatus, as follows:machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads;soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices". Australia customs apply General rate of Free. Statutory unit of measure: ... 2 free trade agreement preferential rates are available for this code.
Tariff Schedule
| Classification | Rate |
|---|---|
一般税率 General rate | Free |
FTA Preferential Rates
2 agreements available · certificate of origin required
| Agreement | Rate |
|---|---|
| IA-CEPA | Free |
| ChAFTA | Free |
Global Benchmark
HS-6 prefix 8486.40 across other jurisdictions