WCO classification path
- Chapter84Machinery and mechanical appliances
- Heading8486Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories
- Subheading848610Machines and apparatus for the manufacture of boules or wafers
- National8486.10.50- - Grinding, polishing and lapping machines for processing of semiconductor wafers
8486.10.50
"- - Grinding, polishing and lapping machines for processing of semiconductor wafers"
HS code 8486.10.50 (Chapter 84 "Machinery and mechanical appliances"; Heading 8486 "Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories"; Subheading 848610 "Machines and apparatus for the manufacture of boules or wafers") under the Philippines tariff schedule classifies "- - Grinding, polishing and lapping machines for processing of semiconductor wafers".
Global Benchmark
HS-6 prefix 8486.10 across other jurisdictions