WCO classification path
- Chapter84Machinery and mechanical appliances
- Heading8486Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories
- Subheading848640Machines and apparatus specified in Note 11(c) to this Chapter
- National8486.40.20- - Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semiconductors; automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices
8486.40.20
"- - Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semiconductors; automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices"
HS code 8486.40.20 (Chapter 84 "Machinery and mechanical appliances"; Heading 8486 "Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories"; Subheading 848640 "Machines and apparatus specified in Note 11(c) to this Chapter") under the Philippines tariff schedule classifies "- - Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semiconductors; automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices".
Global Benchmark
HS-6 prefix 8486.40 across other jurisdictions