84861030

"- - Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers"

HS code 8486103000 (Chapter 84 "Machinery and mechanical appliances"; Heading 8486 "Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories"; Subheading 848610 "Machines and apparatus for the manufacture of boules or wafers") under the Malaysia tariff schedule classifies "- - Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers". Malaysia customs apply Import duty of 0%, Export duty 0%. Statutory unit of measure: u. 10 free trade agreement preferential rates are available for this code.

Tariff Schedule

ClassificationRate
进口税率
Import duty
0%
出口税率
Export duty
0%
销售税 (SST)
Sales tax
5%

FTA Preferential Rates

10 agreements available · certificate of origin required

AgreementRate
ATIGA - ASEAN Trade in Goods Agreement 20220%
ACFTA - ASEAN-China FTA0%
AHKFTA - ASEAN-Hong Kong FTA0%
AKFTA - ASEAN-Korea FTA0%
AJCEP - ASEAN-Japan CEP0%
AANZFTA - ASEAN-Australia-NZ FTA0%
MNZFTA - Malaysia-New Zealand FTA0%
RCEP - Regional Comprehensive Economic Partnership0.0%
CPTPP - Trans-Pacific Partnership0%
MY-UAE-CEPA - Malaysia-UAE CEPA0%

HS-6 prefix 8486.10 across other jurisdictions

8486103000 · - - Machines for working any material by removal of material · Malaysia · Treayo